________________________________________________________________________ http://www.union-ic.com rev.03 jul. 2013 1/5 UM5055 single line esd protection diode array UM5055 sod523 general description the UM5055 esd protection diode is designed to replace multilayer varistors (mlvs) in portable applications such as cell phones, notebook computers, and pda?s. it features large cross-sectional area junctions for conducting high transient currents, offers desirable elect rical characteristics for board level protection, such as fast respon se time, lower operating voltage, lower clamping voltage and no device degradation when compared to mlvs. the UM5055 esd protection diode protects sens itive semiconductor components from damage or upset due to electrostatic discharge (esd) a nd other voltage induced transient events. the UM5055 is available in sod523 package and with working voltages of 5 volt. it gives designer the flexibility to protect one unidi rectional line in applications where arrays are not practical. additionally, it may be ?sprinkled ? around the board in applications where board space is at a premium. it may be used to meet the esd immunity requirements of iec 61000-4-2, level 4 (15kv air, 8kv contact discharge). applications features z cell phone handsets and accessories z microprocessor based equipment personal digital assistants(pda?s) z notebooks, desktops, and servers z portable instrumentation z cordless phones z digital cameras z peripherals z mp3 players z transient protection for data & power lines to iec 61000-4-2 (esd) 15kv (air), 8kv (contact) z small package for use in portable electronics z suitable replacement for mlv?s in esd protection applications z protect one i/o or power line z low clamping voltage z stand off voltage: 5v z low leakage current z solid-state silicon-avalanche technology pin configurations top view zf UM5055 sod523
________________________________________________________________________ http://www.union-ic.com rev.03 jul. 2013 2/5 UM5055 ordering information part number working voltage packaging type channel marking code shipping qty UM5055 5.0v sod523 1 zf 3000pcs/7 inch tape & reel absolute maximum ratings rating symbol value units peak pulse power (tp = 8/20 s) p pk 140 watts maximum peak pulse current (t=8/20 s) i pp 11 amps lead soldering temperature t l 260 (10 sec.) c operating temperature t j -55 to +125 c storage temperature t stg -55 to +150 c symbol definition parameter symbol maximum reverse peak pulse current i pp clamping voltage @ i pp v c working peak reverse voltage v rwm maximum reverse leakage current @ v rwm i r breakdown voltage @ i t v br test current i t forward current i f forward voltage @ i f v f peak power dissipation p pk max. capacitance @ v r = 0v, f = 1mhz c
________________________________________________________________________ http://www.union-ic.com rev.03 jul. 2013 3/5 UM5055 electrical characteristics (t=25c, device for 5.0v reverse stand-off voltage) parameter symbol conditions min typ max unit reverse stand-off voltage v rwm 5 v reverse breakdown voltage v br it = 1ma 6 6.8 7.8 v reverse leakage current i r v rwm = 5v, t=25c 0.1 a i pp = 5a, t p = 8/20 s 9.1 clamping voltage v c i pp =11a, t p = 8/20 s 13 v forward voltage v f i f = 10ma 0.8 v junction capacitance c j v r = 0v, f = 1mhz 40 55 pf junction capacitance c j v r = 2.5v, f = 1mhz 30 40 pf applications information device connection options UM5055 esd protection diode is designed to prot ect one data, i/o, or power supply line. the device is unidirectional and may be used on lin es where the signal polarity is above ground. the cathode band should be placed towards the line that is to be protected. circuit board layout recommendations for suppression of esd good circuit board layout is critical for the s uppression of esd induced transients. the following guidelines are recommended: 1. place the tvs near the input terminals or c onnectors to restrict transient coupling. 2. minimize the path length between the tvs and the protected line. 3. minimize all conductive loops including power and ground loops. 4. the esd transient return path to ground should be kept as short as possible. 5. never run critical signals near board edges. 6. use ground planes whenever possible. for mu ltilayer printed-circuit boards, use ground vias. 7. keep parallel signal paths to a minimum. 8. avoid running protection conductors in parallel with unprotected conductor. 9. minimize all printed-circuit board conductiv e loops including power and ground loops. 10. avoid using shared transient return paths to a common ground point. matte tin lead finish matte tin has become the industry standard lead-fr ee replacement for snpb lead finishes. a matte tin finish is composed of 100% tin solder with large grains. since the solder volume on the leads is small compared to the solder paste volume th at is placed on the land pattern of the pcb, the reflow profile will be determined by the requireme nts of the solder paste. therefore, these devices are compatible with both lead-free and snpb assembly techniques. in addition, unlike other lead-free compositions, matte tin does not have any a dded alloys that can cause degradation of the solder joint.
________________________________________________________________________ http://www.union-ic.com rev.03 jul. 2013 4/5 UM5055 package information UM5055 sod523 outline drawing dimensions millimeters inches symbol min max min max a 0.510 0.770 0.020 0.031 a1 0.500 0.700 0.020 0.028 b 0.250 0.350 0.010 0.014 c 0.080 0.150 0.003 0.006 d 0.750 0.850 0.030 0.033 e 1.100 1.300 0.043 0.051 e1 1.500 1.700 0.059 0.067 e2 0.200ref 0.008ref l 0.010 0.070 0.001 0.003 7ref 7ref land pattern notes: 1. compound dimension: 1.200.80; 2. unit: mm; 3. general tolerance 0.05mm unless otherwise specified; 4. the layout is just for reference. tape and reel orientation
________________________________________________________________________ http://www.union-ic.com rev.03 jul. 2013 5/5 UM5055 important notice the information in this document has been ca refully reviewed and is believed to be accurate. nonetheless, this document is subjec t to change without notice. union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. union rese rves the right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. union semiconductor, inc add: 2f, no. 3, lane 647 songtao road, shanghai 201203 tel: 021-51093966 fax: 021-51026018 website: www.union-ic.com
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